Centerline has recently expanded our diamond sawing department to meet the Wafer Dicing needs of our new and existing customers! Additions include:
- 4 ADT 980 saws
- 2 ADT 7100 saws
Combining these new machines with our current Disco 321 machines gives us the capacity required to fulfil more orders for new and existing customers.
How it's done:
We use computerized diamond saws and CNC controlled surface grinders capable of dicing a variety of shaped parts up to .200" thick. Centerline can also provide diamond machined edges, bevels, V grooves and chamfers per your specifications.
Benefits of dicing your substrates:
- Superior edge quality
- Optical alignment
- Tighter tolerances (accuracy +/-.003" repeatability within .001")
- No heat effected zone
- No stress
- Cleaner environment
- Smaller cell sizes (.005” x .005”)
- Fully patterned substrates (subdivide with computer programmed auto recognition software)
- Thicknesses range from .003” - .200” thick
How to get started:
We will recommend the proper method of mounting your parts for processing depending on the part size, material thickness, and required tolerances. This could be PVC, UV tape, or mounted on glass. We strongly recommend that you contact your vendor of choice before determining the layout of circuits to help provide the most economical and highest quality end product.
New dicing management:
For those who haven't heard, we've also recently gained William Fagan as our new Dicing Manager! His extensive knowledge in diamond sawing and the sizing of materials stems from over 10 years of experience working with various materials in the microelectronic industry.
Like what you see?
Interested in seeing which materials we work with? Visit our Capabilities page.