Centerline provides both mechanical and CMP (chemical mechanical process) polishing techniques depending on the customer’s requirements.
Centerline can make filled vias co-planar with the surface of the substrate using either a one or two step process.
Centerline Technologies is capable of scribing or dicing a variety of shaped parts and finishing with diamond machined edges, bevels and chamfers.
Centerline's laser machining services size the jobs according to specifications.
For all unique or difficult projects, Centerline works to find the right processes.
