Centerline Technologies is pleased to introduce our new Dicing Manager William Fagan! Bill’s extensive knowledge in diamond sawing and the sizing of materials stems from over 10 years of experience with various materials in the microelectronic industry. His incorporation plays a key role in the overall expansion of our dicing capabilities.
Additionally, Centerline acquired four more diamond saws, resulting in more than double the original capacity for dicing. Centerline understands the increasing demand for fast deliveries and tight tolerances and is now more equipped than ever to meet your needs.
We welcome all RFQ’s (request for quotes) and will respond immediately. Please include a drawing or print for better accuracy when sending a request.
Send all RFQ’s to firstname.lastname@example.org or for more information