Centerline can laser drill, scribe or cut a variety of substrates to your specifications. |
Centerline Technologies offers laser machining as a service to our lapping and polishing customers to size their jobs according to the requirements needed. Substrates can be laser drilled, scribed or cut to customer specifications.
Scribed edge to scribe lines +/- .003''
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cut outs or hole center
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Cut edge or alignment flats +/- .001''
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to scribe line, holes or cut features
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Internal features to other features +/- .001''
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or scribe lines
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Hole Diameter with pin gage +/- .001''
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(go/no-go)
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Hole Taper
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.002-.030'' thick .002''
.031-.045'' thick .003'' .046-.100'' thick .004'' |
Scribe Depth
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.005-.030'' thick 40% of thickness
.031-.100'' thick 45-50% of thickness |
Pulse Spacing
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.005-.030'' thick .003-.007''
.031-.100'' thick .005-.009'' |
Centerline
Technologies, LLC
577 Main Street
Suite 270
Hudson, MA 01749
Call: 978-568-1330
Fax: 978-568-1334