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Centerline can laser drill, scribe or cut a variety of substrates to your specifications. |
Centerline Technologies offers laser machining as a service to our lapping and polishing customers to size their jobs according to the requirements needed. Substrates can be laser drilled, scribed or cut to customer specifications.

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Scribed edge to scribe lines +/- .003''
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cut outs or hole center
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Cut edge or alignment flats +/- .001''
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to scribe line, holes or cut features
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Internal features to other features +/- .001''
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or scribe lines
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Hole Diameter with pin gage +/- .001''
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(go/no-go)
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Hole Taper
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.002-.030'' thick .002''
.031-.045'' thick .003'' .046-.100'' thick .004'' |
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Scribe Depth
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.005-.030'' thick 40% of thickness
.031-.100'' thick 45-50% of thickness |
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Pulse Spacing
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.005-.030'' thick .003-.007''
.031-.100'' thick .005-.009'' |
Centerline
Technologies, LLC
577 Main Street
Suite 270
Hudson, MA 01749
Call: 978-568-1330
Fax: 978-568-1334
