Centerline Technologies will be exhibiting at Microwave Journal's first Electronic Design Innovation Conference USA in Boston this September! An array of substrates demonstrating our ultra-precision finishing capabilities will be on display at booth 708.
Our team is looking forward to speaking with you, so swing by the booth to meet President / CEO Hugh Muffoletto and our New Business Development representative Barry Beauchesne.
If you are interested in seeing samples of our work please stop by booth 708. The following processes will be exhibited:
- wafer dicing
- laser machining
- diamond polishing
- filled via planarity
- and more
Materials present will include:
- Aluminum Nitride/AlN
- Beryllium Oxide/BeO
- and more!
if you do not see a material or process listed that you would be interested in seeing a sample of, or if you would like to schedule a time in advance to meet with a member of the Centerline Team.
See you at EDI CON USA in Boston!