Centerline Technologies is dedicated to providing the polishing of advanced materials to surface finishes and supplier quality levels that consistently meet or exceed our customer’s expectations.

Advanced level polishing requires that appropriate abrasive and pre-lapping conditions be used to significantly reduce sub-surface damage. Centerline uses both mechanical and CMP (chemical mechanical process) depending on the customers requirements. We are constantly looking for ways to enhance the processes that we have already established, while maintaining careful process controls and qualifications.

Centerline Technologies’ polishing process controls the surface finish and, combined with our lapping process, assures thickness identity and parallelism, as well as flatness of substrates. Our lapping and polishing processes are custom designed for each type of material and the physical dimensions required.