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Visit us at 2009 IEEE MTT-S June 9-11th Boston MA

  • Centerline uses both mechanical and chemical mechanical process (CMP) to meet the polishing needs of our customers.

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Unit Conversion Chart
A guide to engineers and purchasing professionals in the design and procurement of thin and thick film circuit substrates.

Polishing

Centerline Technologies is dedicated to providing the polishing of advanced materials to surface finishes and supplier quality levels that consistently meet or exceed our customer’s expectations.

Advanced level polishing requires that appropriate abrasive and pre-lapping conditions be used to significantly reduce sub-surface damage. Centerline uses both mechanical and CMP (chemical mechanical process) depending on the customers requirements. We are constantly looking for ways to enhance the processes that we have already established, while maintaining careful process controls and qualifications.

Centerline Technologies’ polishing process controls the surface finish and, combined with our lapping process, assures thickness identity and parallelism, as well as flatness of substrates. Our lapping and polishing processes are custom designed for each type of material and the physical dimensions required.

Material
Surface Finish
(u-inches
)
Thickness Tolerance
Applications
As fired 99.6%
< 4
+/- 10%
or +/- 5%
Use for low to medium power DC & RF circuits
Polished 99.6% Alumina
< 1
+/- .0005" Use for low to medium power RF, Microwave, and Optical interconnects
Polished 99.5% Beryllium Oxide
< 3
+/- .0005" Use for high power DC/RF/Microwave & Optical applications
Polished Aluminum Nitride
< 2
+/- .0005" Use for higher power DC/RF/Microwave & Optical applications
Polished Fused Silica
< .1
+/- .0005" Use for Optical or High Frequency interconnects requiring extremely low loss transmission performance
Polished Titanates
< 3
+/- .0005" RF & Microwave devices requiring high Q performance