Centerline can laser drill, scribe or cut a variety of substrates to your specifications.

Tradeshows

Visit us in IMS 2012 Booth #2625 at IEEE MTT-S June 17-22, 2012 in Montréal, Canada.

Laser Machining

Centerline Technologies offers laser machining as a service to our lapping and polishing customers to size their jobs according to the requirements needed. Substrates can be laser drilled, scribed or cut to customer specifications.

Tolerances for Ceramic and Aluminum Nitride

Scribed edge to scribe lines +/- .003''

cut outs or hole center

Cut edge or alignment flats +/- .001''

to scribe line, holes or cut features

Internal features to other features +/- .001''

or scribe lines

Hole Diameter with pin gage +/- .001''

(go/no-go)

Hole Taper :

.002-.030'' thick .002''

.031-.045'' thick .003''

.046-.100'' thick .004''

Scribe Depth:

.005-.030'' thick 40% of thickness

.031-.100'' thick 45-50% of thickness

Pulse Spacing:

.005-.030'' thick .003-.007''

.031-.100'' thick .005-.009''

Notes:

    1. A minimum border of five times the thickness should be left between a scribed edge to be broken and an As Fired edge of the plate.
    2. Sharp corners should have a radius to reduce stress induced cracking.
    3. No two machined features should have edges closer to the other than one material thickness.
    4. Tighter tolerances can be achieved upon request.
    5. All tolerances are in inches.
    6. Tolerances are non-cumulative.