NewsTradeshows ● Articles

Visit us at 2009 IEEE MTT-S June 9-11th Boston MA

  • Centerline can laser drill, scribe or cut a variety of substrates to your specifications.

Download Page as PDF pdf document

Unit Conversion Chart
A guide to engineers and purchasing professionals in the design and procurement of thin and thick film circuit substrates.

Laser Machining

Centerline Technologies offers laser machining as a service to our lapping and polishing customers to size their jobs according to the requirements needed. Substrates can be laser drilled, scribed or cut to customer specifications.

Tolerances for Ceramic and Aluminum Nitride

Scribed edge to scribe lines, +/- .003

cut outs or hole center

Cut edge or alignment flats +/- .001

to scribe line, holes or cut features

Internal features to other features +/- .001

or scribe lines

Hole Diameter with pin gage +/- .001

(go/no-go)

Hole Taper :

.002-.030 thick .002 .031-.045 thick .003 .046-.100 thick .004

Scribe Depth:

.005-.030 thick 40% of thickness .031-.100 thick 45-50% of thickness

Pulse Spacing:

.005-.030 thick .003-.007 .031-.100 thick .005-.009

Notes:

    1. A minimum border of five times the thickness should be left between a scribed edge to be broken and an As Fired edge of the plate.
    2. Sharp corners should have a radius to reduce stress induced cracking.
    3. No two machined features should have edges closer to the other than one material thickness.
    4. Tighter tolerances can be achieved upon request.
    5. All tolerances are in inches.
    6. Tolerances are non-cumulative.