Lapping

 
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Lapping Capabilities
  • The lapping process is used to provide flatness, parallelism, thickness identity, and surface finishes to extremely demanding tolerances.

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Die-Level Lapping

 

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A guide to engineers and purchasing professionals in the design and procurement of thin and thick film circuit substrates.

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Centerline Technologies uses free abrasive lapping processes that are used to provide flatness, parallelism, thickness identity, and surface finishes to extremely demanding tolerances.

Lapping is a free abrasive machining process. An abrasive (various compounds) mixed in a slurry is applied to a lap. The work part is placed on top of the lap in fixtures and both lap and work plates are moving. This creates the cutting action/material removal at a controlled rate. Using various methods and unique processes Centerline can finish pieces without introducing stresses and heat damage associated with other processes such as grinding.

The selection of abrasive, pressure, speed of machine and shape of the lap all play a critical roll in the outcome of your finished product. Using SPC processes, the controls at Centerline Technologies will provide you with a repeatable product from one lot to the next, again and again, time after time.  

Here at Centerline Technologies we use single and double sided lapping, and you can be assured that we will recommend the processes that will benefit your product the most, and to provide the highest quality at the most economical rate.

Material
Surface Finish
(u-inches
)
Thickness Tolerance
Applications
As fired 99.6% alumina
< 4
+/- 10%
or +/- 5%
Use for low to medium power DC & RF circuits
Polished 99.6% Alumina
10 u-in nominal
+/- .0005" Use for low to medium power RF & Microwave circuits
Lapped 99.5% Beryllium Oxide
20-30 u-in
+/- .0005" Use for high power DC/RF/Microwave circuits
Lapped Aluminum Nitride
12 u-in nominal
+/- .0005" Use for higher power DC/RF/Microwave circuits
Lapped Fused Silica
10u-in nominal matte finish
+/- .0005" Use for high frequency circuits requiring extremely low loss performance
Lapped Titanates
15-30 u-in
+/- .0005" RF & Microwave circuits requiring high Q