CENTERLINE technologies
Overview Lapping Polishing Laser Machining Diamond Sawing Filled Via Contact


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Diamond Sawing and Machining
  • Centerline offers diamond machined edges, bevels, V grooves and chamfers per your specifications.

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Unit Conversion Chart
A guide to engineers and purchasing professionals in the design and procurement of thin and thick film circuit substrates.

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Centerline Technologies uses computerized diamond saws and CNC controlled surface grinders capable of  scribing or dicing a variety of shaped parts up to .200” thick. Centerline can also provide diamond machined edges, bevels, V grooves and chamfers per your specifications.

Benefits of Dicing Substrates:

  • Superior edge quality
  • Optical alignment
  • Tighter tolerances (accuracy +/-.0003’ repeatability within .0001”)
  • No heat effected zone
  • No stress
  • Cleaner environment
  • Smaller cell sizes (.005” x .005”)
  • Fully patterned substrates (subdivide with computer programmed auto recognition software)
  • Thicknesses range from .003” - .200” thick
Centerline Technologies will recommend the proper method of mounting your parts for processing depending on the part size, material thickness and required tolerances. This could be PVC, UV tape or mounted on glass. We strongly recommend that you contact your vendor of choice before layout of circuits to help provide the most economical and highest quality end product.