99.6% Alumina Specification Chart

Specifications are offered as assistance to Engineers and Purchasing professionals in the design and procurement of thin and thick film circuit substrates.

Centerline Technologies makes no certification as to the suitability of materials for any application.

Properties

Units

Polished High
Density 99.6%
Alum. Oxide

As-Fired High
Density 99.6%
Alum. Oxide
Hi-rel Grade

Chemical Composition

 

Al2O3

Al2O3

Purity

%

99.6

99.6

Color

 

White

White

Nominal Density

g/cm3

3.87

3.87

Surface Finish (Polished)

µ-inches

<1.0

N/A

Surface Finish (Lapped)

µ-inches

8-15*

N/A

Surface Finish (As-Fired)

µ-inches

N/A

2-3

Camber

inch/inch

.0003/.0005

.002

Thickness

inches

0.004-.040*

0.005-0.025*

Thickness Tolerance

inches

±0.0005

±0.001*

Process Sizes

Inches (L/W)

1.0/6.0

1.0/6.0

Coefficient of Thermal Expansion (CTE)

10-6

7.0-8.3 (25-1000°C)

7.0-8.3 (25-1000°C)

Thermal Conductivity

Watts/mK

26.9

26.9

Dielectric Constant

@1 MHz

9.9±0.1

9.9±0.1

Dielectric Constant

@4 MHz

9.9

9.9

Dielectric Constant

@10 MHz

9.7

9.7

Dissipation Factor (Loss Tangent)

@1 MHz

0.0001

0.0001

Dissipation Factor (Loss Tangent)

@10 MHz

0.0002

0.0002

Q

@1 GHz

5000

5000

Hardness

Rockwell

87

87

Flexural Strength

K(10-3) lbs/sq.in.

90

90

Compressive Strength

M(10-3) lbs/sq.in.

54

54

Grain Size

um (microns)

<1.0

<1.0

  • * Additional thicknesses and tolerances available upon request.
  •    Basis for specifications available upon request.